Silicone Thermally Conductive Encapsulant

The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry.

Silicone thermally conductive encapsulant.

They also provide protection from harsh environments vibration and thermal shock. Thermally conductive silicone encapsulant. Primerless adhesion to metals and plastics. Thermally conductive encapsulant designed for fast fill rates and reworkability with moderate thermal conductivity gray 3 200 addition cure.

Silco therm thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. Thermally conductive silicones from dow come in a wide range of viscosities cure speeds and delivery systems to meet the growing need for improved thermal management in electronics designs for virtually every industry. Thermally conductive silicone adhesives momentive performance materials developed its family of silcool thermally conductive adhesives to help deliver thin bond lines which contribute to low thermal resistance while providing excellent adhesion and reliability. Unable to complete action likely due to connectivity to dow s back end service.

Good thermal conductivity 0 7 w m k low viscosity 4000cps. Dowsil cn 8760 thermally conductive encapsulant please contact dow for distribution options available for this product. Lord cooltherm sc 324 thermally conductive silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical electronic encapsulating applications while retaining desirable properties associated with silicones. Lord cooltherm sc 6703 thermally conductive silicone encapsulant is a two component system designed to provide thermal conductivity for encapsulating densely packed power units.

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