It can be used as a solder replacement for bonding heat sensiti.
Silver epoxy adhesive.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.
Low linear shrinkage upon cure.
Silver filled electrically conductive epoxy adhesive.
Serviceable from 4k to 250 f.
This adhesive bonds very well to a variety of surfaces.
It has a convenient 1 to 1 ratio ten minutes work life and a moderate curing rate.
It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive connections.
One component heat curing silver conductive epoxy adhesive.
It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive.
8331 is an electrically conductive silver filled two part epoxy adhesive.
The 8331 silver conductive epoxy adhesive.
8331 is an electrically conductive silver filled 2 part epoxy adhesive.
It cures at low temperatures to avoid damage to electronic equipment and bonds well to most materials.
This product allows for quick cold soldering repairs.
This product allows for quick cold soldering repairs.
Cures at room temperature.
Moderate cure high conductivity are an economical electronic epoxy with good electrical and thermal conductivities.
Excellent peel and shear strength.
The mg chemicals 8331 is a two part silver filled epoxy adhesive with good conductivity and a faster working time than mg chemicals 8331s adhesive to bond electronic devices form conductivity seals and cold solder heat sensitive materials.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.